Our Services & Solutions
Our Services & Solutions
We aim to be a strategic partner to our customer, helping our customers to bring their products to life.
We aim to be a strategic partner to our customer, helping our customers to bring their products to life.
Our Operations
Our Operations
Services & Solutions
Services & Solutions
- Wafer Bumping
- Fine print wafer screen-printing bumping
- SAC Solder bump
- Full Solder reflow
- Half-moon reflow solder geometry
- Wafer Probing
- Bumped Cu Pillar and SAC bump alloy and un-bumped 6”, 8” and 12” wafers
- Pyramid core probe contact technology
- Pogo pin probe contact technology
- Cantilever probe contact technology
- Variance probing handler capability
- Tight controlled temperature probing (+/- 0.5deg C)
- ATE and Rack & Stack probing equipment capability
- Wafer Processing
- Partial and full saw options
- Scribe & break
- Plasma etch for less than 25um saw street
- Wafer thinning: Grinding before saw and dicing before grinding process options
- Coded and 2DID die back marking
- 2D and 3D automatic vision inspection
- Internal die level defect (MEMS)
Wafer Probe & Processing Gallery
Wafer Probe & Processing Gallery
- Assembly (SMT & MCOB)
- Stencil printed SAC solder with on-the-fly solder inspection
- Dispensing solder, glue or thermal interface material
- Passive components: size 008004
- Active components: IC, mosfet, heatsink
- Substrate: Pad diameter: 115um, Pad pitch: 200um
- Packages:
- LGA – SiP
- LGA – Cu-Pillar SiP
- LGA – Double Sided Mold
- FCBGA – Molded Under Filled (UHD Substrate)
- FCBGA – Liquid Under Filled (Singulated Substrate)
- Hermetic, Leaded, Sensors & LED
- System on Module
- Fiber transceiver packages
- Electromagnetic interference shielding capability:
- internal package (die level shield)
- package level
- tester level (DUT-level)
Assembly Gallery
Assembly Gallery
| 1. Radio Frequency Testing (20GHz) |
| 2. Fibre LIV / Dynamic Testing |
| 3. Optical / 3D Sensor Testing |
| 4. Test Design & Development |
| 5. Complex High Speed ASIC Testing |
Package Test Gallery
Package Test Gallery
| 1. Process and packaging with full test development and qualification methodology |
| 2. New Product Introductions services (NPI) |
| 3. Failure Analysis and Reliability Lab |
| 4. Customize process and automation system |
| 5. Customize data processing and control system (In-house iMES Inari Manufacturing Execution System) |
| 6. Customer Interactive Tracking Portal with full indices visualization |
| 7. Equipment remote access system |
| 8. Complete package to die level traceability, traceability & genealogy system |
| 9. Burn-in, Pre-cond & MSL Packing |
| 10. Vendor Management Inventory & drop ship |
Other Services
Other Services
