Process Capability
Inari Process Capability
Category | Description | Unit | Inari |
---|---|---|---|
Wafer Sort | Wafer backlap - Si wafer | Yes | |
- Max wafer size | in | 8 | |
- Min thickness | um | 125 | |
- Thickness accuracy | um | 12.5 | |
Wafer DC probe | um | Yes | |
Wafer RF probe | um | Yes | |
Auto wafer visual and reject capture into wafer map (inkless wafer map) | Yes | ||
Manual wafer visual and inking | Yes | ||
Wafer saw - Si wafer | Yes | ||
Wafer saw - GaAs wafer | No | ||
Wafer scribe and break | Yes | ||
Wafer laser cut | No | ||
Die level tape and reel (for die sell) | Yes | ||
SMT | Smallest SMT component | 01005 | |
Die level tape and reel (for die sell) | Yes | ||
Smallest 01005 pad | um | 175x225 | |
DA | Thinnest die (Si and GaAs) | mil | 4 |
Smallest die size | mil | 7.3x7.3 | |
Medium thermal epoxy (3-10W/mK) | 1295SA | ||
Low thermal epoxy (<3W/mK) | 84-1LMIS | ||
Eutectic DA capability | No | ||
Biggest die aspect ratio for GaAs die with 4- 5mil thickness | mil | 2:1 | |
Post DA, auto chip coating | No | ||
Stack die capability | Yes | ||
Flip chip capability | Yes | ||
WB | Gold wire size | mil | 1.0 |
Al pad bonding capability | Yes | ||
Die to die bonding capability | Yes | ||
Gold ball bond, min bond pad opening for 1mil wire | um | 60 x 60 | |
Gold ball bond, min wire loop for 1.0mil wire | um | 100(Std. Bond) 60(RSSB) | |
Minimum bond pad pitch for 1.0mil wire | um | 75(Bond pad on die)
75(Bond pad on PCB) |
|
Gold ball bond, min bond pad opening for 0.8mil wire | um | NA | |
Gold ball bond, min wire loop for 0.8mil wire | um | NA | |
Minimum bond pad pitch for 0.8mil wire | mm | NA | |
Mold | Available mold cap height | mm | 0.5 and 0.6 |
Ultra low stress compound - for product with high internal stress | Yes | ||
Mold mc with void vacuum (qty) / total mold mc qty | Yes | ||
Mold mc with panel vacuum(qty) / total mold mc qty | Yes | ||
Saw | Package saw accuracy | um | 50 |
Smallest package | mm | 1.6 x 2.0 | |
Test | RF Test capability | Yes | |
Reliability | IR | Yes | |
UBPP | Yes | ||
FA | X-Section / Backlap | Yes | |
X-Ray | Yes | ||
T/C - Scan | Yes |
Amertron Process Capability
Category | Description | Unit | Amertron |
---|---|---|---|
DA | Thinnest die (Si and GaAs) | mil | 4 |
Smallest die size | mil | 8*8 | |
WB | Gold wire size | mil | 0.8~1.2 |
Al pad bonding capability | Yes | ||
Die to die bonding capability | Yes | ||
Gold ball bond, min bond pad opening for 0.8mil wire | um | 55 x 55 | |
Gold ball bond, min wire loop for 0.8mil wire | um | 85 | |
Minimum bond pad pitch for 0.8mil wire | um | 60 | |
Aluminium wire size | um | 1.2 | |
Mold | Available mold cap height | mm | 0.6~1.2 per customization |
Ultra low stress compound - for product with high internal stress | Yes | ||
Mold mc with void vacuum (qty) / total mold mc qty | Yes | ||
Mold mc with panel vacuum(qty) / total mold mc qty | Yes | ||
Cap Welding | Welding size | TO18,46,39,5 | |
Casting | Jetting capability | Yes | |
Dispensing capability | Yes | ||
Saw | Package saw accuracy | um | 50 |
Smallest package | mm | 2.3*1.95 | |
Trim/Form | Leads Trim/Form capability | Yes | |
Final Test | Electrical test capability | Yes | |
Optical test capability | Yes | ||
Reliability | Reflow Oven | Yes | |
Thermal Cycling | Yes | ||
FA | X-Section | Yes | |
X-Ray | Yes |