Process Capability
Inari Process Capability
| Category | Description | Unit | Inari |
|---|---|---|---|
| Wafer Sort | Wafer backlap - Si wafer | Yes | |
| - Max wafer size | in | 8 | |
| - Min thickness | um | 125 | |
| - Thickness accuracy | um | 12.5 | |
| Wafer DC probe | um | Yes | |
| Wafer RF probe | um | Yes | |
| Auto wafer visual and reject capture into wafer map (inkless wafer map) | Yes | ||
| Manual wafer visual and inking | Yes | ||
| Wafer saw - Si wafer | Yes | ||
| Wafer saw - GaAs wafer | No | ||
| Wafer scribe and break | Yes | ||
| Wafer laser cut | No | ||
| Die level tape and reel (for die sell) | Yes | ||
| SMT | Smallest SMT component | 01005 | |
| Die level tape and reel (for die sell) | Yes | ||
| Smallest 01005 pad | um | 175x225 | |
| DA | Thinnest die (Si and GaAs) | mil | 4 |
| Smallest die size | mil | 7.3x7.3 | |
| Medium thermal epoxy (3-10W/mK) | 1295SA | ||
| Low thermal epoxy (<3W/mK) | 84-1LMIS | ||
| Eutectic DA capability | No | ||
| Biggest die aspect ratio for GaAs die with 4- 5mil thickness | mil | 2:1 | |
| Post DA, auto chip coating | No | ||
| Stack die capability | Yes | ||
| Flip chip capability | Yes | ||
| WB | Gold wire size | mil | 1.0 |
| Al pad bonding capability | Yes | ||
| Die to die bonding capability | Yes | ||
| Gold ball bond, min bond pad opening for 1mil wire | um | 60 x 60 | |
| Gold ball bond, min wire loop for 1.0mil wire | um | 100(Std. Bond) 60(RSSB) | |
| Minimum bond pad pitch for 1.0mil wire | um | 75(Bond pad on die)
75(Bond pad on PCB) |
|
| Gold ball bond, min bond pad opening for 0.8mil wire | um | NA | |
| Gold ball bond, min wire loop for 0.8mil wire | um | NA | |
| Minimum bond pad pitch for 0.8mil wire | mm | NA | |
| Mold | Available mold cap height | mm | 0.5 and 0.6 |
| Ultra low stress compound - for product with high internal stress | Yes | ||
| Mold mc with void vacuum (qty) / total mold mc qty | Yes | ||
| Mold mc with panel vacuum(qty) / total mold mc qty | Yes | ||
| Saw | Package saw accuracy | um | 50 |
| Smallest package | mm | 1.6 x 2.0 | |
| Test | RF Test capability | Yes | |
| Reliability | IR | Yes | |
| UBPP | Yes | ||
| FA | X-Section / Backlap | Yes | |
| X-Ray | Yes | ||
| T/C - Scan | Yes |
Amertron Process Capability
| Category | Description | Unit | Amertron |
|---|---|---|---|
| DA | Thinnest die (Si and GaAs) | mil | 4 |
| Smallest die size | mil | 8*8 | |
| WB | Gold wire size | mil | 0.8~1.2 |
| Al pad bonding capability | Yes | ||
| Die to die bonding capability | Yes | ||
| Gold ball bond, min bond pad opening for 0.8mil wire | um | 55 x 55 | |
| Gold ball bond, min wire loop for 0.8mil wire | um | 85 | |
| Minimum bond pad pitch for 0.8mil wire | um | 60 | |
| Aluminium wire size | um | 1.2 | |
| Mold | Available mold cap height | mm | 0.6~1.2 per customization |
| Ultra low stress compound - for product with high internal stress | Yes | ||
| Mold mc with void vacuum (qty) / total mold mc qty | Yes | ||
| Mold mc with panel vacuum(qty) / total mold mc qty | Yes | ||
| Cap Welding | Welding size | TO18,46,39,5 | |
| Casting | Jetting capability | Yes | |
| Dispensing capability | Yes | ||
| Saw | Package saw accuracy | um | 50 |
| Smallest package | mm | 2.3*1.95 | |
| Trim/Form | Leads Trim/Form capability | Yes | |
| Final Test | Electrical test capability | Yes | |
| Optical test capability | Yes | ||
| Reliability | Reflow Oven | Yes | |
| Thermal Cycling | Yes | ||
| FA | X-Section | Yes | |
| X-Ray | Yes |